Integrated, modular solutions to address power and density challenges for AI environments will be unveiled at the 2025 OCP Global Summit
COLUMBUS, Ohio, Oct. 10, 2025 -- Vertiv (NYSE: VRT), a global leader in critical digital infrastructure, today announced new rack, power, and cooling technologies designed to align with Open Compute Project (OCP) design guidelines and support high-density, energy-efficient data center environments. The innovations will be featured at the 2025 OCP Global Summit, Booth #C34, October 13–16, highlighting Vertiv's continued commitment to advancing open and flexible infrastructure for evolving AI and compute workloads.
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