AI-Driven EDA and Broad IP Solutions Enable Differentiated Designs on TSMC Advanced Processes and SoIC Technologies
Key Highlights
- Certified digital and analog flows on the TSMC N2P and A16™ processes using TSMC NanoFlex™ architecture boost performance and speed analog design migration
- 3DIC Compiler platform and 3D-enabled IP enable multiple customer tape outs using advanced 3D stacking and CoWoS packaging technologies
- AI-optimized photonic flow for TSMC Compact Universal
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