GENIO EVO Tackles Advanced Packaging
Thermal and Mechanical Roadblocks
ROME, Jan. 14, 2025 -- MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, today unveiled GENIO EVO, the first integrated chiplet/package EDA tool to address in pre-layout stage the two major issues of 3D-IC design, thermal and mechanical stress. MZ will demonstrate this new tool at the Chiplet Summit, being held from January 21-23, 2025 at the Santa Clara Convention Center.
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