Comprehensive Technology and Strong Ecosystem Support Delivering Higher Performance, Customization and Flexibility for Rack-, Row- and Cloud-scale AI Networks
SANTA CLARA, Calif., March 31, 2025 -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase its interconnect portfolio for scale-up and scale-out AI deployments at OFC 2025, taking place March 31–April 3 in San Francisco, CA. Marvell will share its strategy and vision through multiple presentations and demonstrations in its booth #2129 and partner booths.
Interconnect technology—the semiconductors, software and system that serve as a nervous system for reliably and rapidly transmitting data across accelerated infrastructure—is in the midst of a revolution. The rapid buildout of data infrastructure worldwide is expected to more than triple the market for interconnect chipsets to $11.5 billion by 2030, according to LightCounting. Additionally, interconnect technology will undergo a fundamental transformation, advancing to support higher speeds, extended distances, reduced latencies and increased data traffic volumes essential for training, inference and other AI and cloud services in the coming years.
For scale-up fabrics in racks and rows, co-packaged optics (CPO), linear packaged optics (LPO), co-packaged copper (CPC), active electrical cable (AEC) and PCIe retimer interconnect technologies will pave the way for row-scale computing systems containing hundreds of XPUs and CPUs several meters apart spread over multiple racks that can outperform today's systems in performance-per-watt and time-to-completion. New scale-out networking technologies such as 400G/lane networking and coherent-lite DSPs will greatly increase the carrying capacity of networks while extending the reach of links from meters to kilometers for more powerful, versatile cloud-scale infrastructure.
Products, technology and ecosystem initiatives Marvell will showcase at OFC 2025 include:
- 400G PAM4 Technology. A live demonstration of the industry's first 400G/lane technology with a complete electrical to optical link operating at 224 Gbaud. 400G is a critical step towards 3.2T optical interconnects and 204.8T switches.
- Co-Packaged Platforms for AI Scale Up and Scale Out. Marvell to showcase its CPO and CPC technologies for achieving higher interconnect densities and longer reach. Marvell will showcase system-level XPU and switch implementations supporting rapid servicing and ease of manufacture.
- 1.6T Silicon
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