LAS VEGAS, Jan. 8, 2025 -- HCMF Group, a global leader in Tier 1 automotive parts and systems, is proud to unveil its groundbreaking advancements in smart cockpit and body mechatronic systems at CES 2025, held from January 7 to January 9. Partnering with industry leaders such as AUO, AGC, Inventec, TMYTEK (TMY Technology Inc.), BenQ Materials, and KINPO GROUP, HCMF is redefining intelligent mobility through transformative innovations and unmatched integration capabilities.
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