• 14 Mar, 2025

DDC Solutions to Unveil 600 kW Air and Liquid to Chip Cooling Solution at NVIDIA GTC AI Conference

DDC Solutions to Unveil 600 kW Air and Liquid to Chip Cooling Solution at NVIDIA GTC AI Conference

SAN DIEGO, March 11, 2025 -- DDC Solutions, the leader in data center cooling and management technology, is excited to announce that it will unveil its 600kW air and liquid-to-chip cooling joint solution with partner Chilldyne, the leading provider of negative pressure, direct to chip cooling technology. This debut will be at the NVIDIA GTC AI Conference, taking place from March 17-21 in San Jose, CA. DDC Solutions will be exhibiting and speaking at this premier event, showcasing their latest innovations in data center cooling live in booth #1037.

DDC Solutions will be joined in their booth by Chilldyne, with an operating demonstration of an ultra-high-density air and liquid-to-chip cooling solution. In this collaboration, Chilldyne's cutting-edge technology supports up to 500 kW of chip-level thermal dissipation, while DDC's S-Series V4 cabinets provide an additional 100 kW of air cooling. The combined solution will be capable of bringing a remarkable 600 kW of cooling per rack.

"The integration between DDC cabinets and Chilldyne's direct-to-chip cooling technology highlights the ease with which high-density workloads can be deployed in data centers and colocation facilities, regardless of the facility's original thermal design" said Alan Russo, Chief Revenue Officer at DDC. "We are excited to show off how innovative features like DDCs NEMA 3R certification, built-in security, and fire suppression, redundant motors and coils, and granular environmental control, help to future proof and mitigate risk for high-end, expensive GPU deployments."  

"Chilldyne's innovative negative pressure technology creates a vacuum to circulate water by pulling it through the cooling system. This approach removes the need for costly, heavy-duty plumbing to the racks, ensures easy setup and upkeep, and eliminates leaks in a system with no single point of failure," said Steve Harrington, Founder and CEO of Chilldyne. "The four key elements of our CDU-to-Cold Plate solution are the CDU, Rack Manifold, Cold Plates and our Cool-Flo software, enabling us to remotely monitor and operate the Chilldyne CDU using a web-based interface, industry-standard protocol, or integration with DCIM and BMS software."

In addition to the booth and demo, Chris Orlando, Co-founder and Chief Strategy Officer at DDC Solutions will be speaking on "Data Center Operators Must Lower Risk as GPU Costs Rise: Future-Proof Your Data Center" at the GTC Expo Theater on March 18, 2025, at 4:20 pm. In this session, Chris will address the growing demand for AI accelerators and the rising costs associated with deploying GPUs, power, cooling, and data center construction. He will also discuss how DDC mitigates risk by lowering the loss footprint from an entire data center to a single cabinet, while delivering ultra-high-density cooling.

For more information and to schedule a demo or meeting visit ddcsolutions.com/gtc-2025.

About DDC Solutions 

DDC Solutions offers ultra-high-density data center cooling that lowers total cost of ownership through its dynamic management software and patented cabinet technology. Delivering 100kW air and 400kW+ liquid-to-the-chip ready cooling per cabinet, our Dynamic Density ControlTM (DDC) technology lowers risk and future-proofs your data center with intelligent power handling and sustainable enterprise environment controls managed by real-time monitoring software. DDC is recognized by large-scale colocation service providers, hyperscalers, enterprise data centers, and their design engineers to push beyond the limits of existing data center capabilities.  DDC provides a complete solution in a single cabinet that is scalable and flexible to exceed AI/HPC demands.

About Chilldyne 

Founded in 2012, and originating from solving aerospace and life sciences engineering design problems, Chilldyne delivers dependable, leak-proof Direct-to-Chip (DTC) liquid cooling solutions to enterprises, colocation data centers and research institutions globally.  In short, Chilldyne drives down TCO, and drives up reliability. Chilldyne's patented, fail-safe systems use advanced negative pressure technology and smart redundancy to prevent leaks and maximize uptime. Easy to install and maintain, Chilldyne's family of CDUs, manifolds, switch-over valves and cold plates deliver end-to-end liquid cooling solutions, ensuring unmatched cooling performance for a sustainable approach to managing your server environment.

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